简介
该设备实现了透射电子显微镜（TEM）样品的首次准备即达到zui佳状态，确保样品质量高且无非晶层和植入层。它与聚焦离子束（FIB）技术互补，可在不引入人工痕迹的情况下进行研磨，并配备了先进的探测器技术用于成像和精确终点检测。此外，该设备支持离子和电子的原位成像，具有显微镜连接功能以实现样品处理的安全性，并具备快速、可靠和易于使用的特点。
Optimal TEM specimen preparation done First Time Right
Achieve ultimate specimen quality – free from amorphous and implanted layers
Complements FIB technology
Milling without introduction of artifacts
Advanced detector technology for imaging and precise endpoint detection
In situ imaging with ions and electrons
Microscope connectivity for risk-free specimen handling
Adds capability and capacity
Fast, reliable and easy to use
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